发明名称 MOLD FOR RESIN MOLDING AND RESIN MOLDED ARTICLE FORMED BY USING THE MOLD
摘要 <p>Disclosed is a mold for resin molding which can produce a resin molded article having a precise shape without the occurrence of defective molding and can be manufactured in a simple manner. Also disclosed is a resin molded article having a hydrophilic property. A mold (10) for resin molding comprises a shaping die (12). The shaping die (12) has a first heat-insulating layer (14) and a second heat-insulating layer (16) on its inner side. The first heat-insulating layer (14) is made of a heat-curable resin having a curing temperature of 200°C or lower, and the second heat-insulating layer (16) is made of a mixture of a heat-curable resin which is the same as that used for the first heat-insulating layer (14) and a ceramic granule (18). The second heat-insulating layer (16) is formed in such a manner that the surface has microasperities having an arithmetic average roughness (Ra) of 11 to 13 µm and the maximum height (Pt) of 50 to 100 µm (wherein Ra and Pt are as defined according to ISO 4287: '97). By using the mold (10), the fluidability of a molted resin in the mold becomes better and it is possible to produce a resin molded article which precisely copies the shape of the microasperities of the second heat-insulating layer (16).</p>
申请公布号 WO2007015390(A1) 申请公布日期 2007.02.08
申请号 WO2006JP314620 申请日期 2006.07.25
申请人 TANAZAWA HAKKOSHA CO., LTD.;SOGABE, MITSUSHI;SUGITA, TSUTOMU 发明人 SOGABE, MITSUSHI;SUGITA, TSUTOMU
分类号 B29C33/38;B29C33/42;B29C45/37 主分类号 B29C33/38
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