发明名称 PATTERN MANUFACTURING SYSTEM, EXPOSURE DEVICE, AND EXPOSURE METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a pattern manufacturing system for suppressing irregularity of line width of a pattern line on a both-face substrate, and to provide an exposure device and an exposure method. <P>SOLUTION: The pattern manufacturing system comprises exposure to directly draw a resist overlying on a copper foil formed on both the faces of the substrate by using the line width of the pattern line and an exposure amount designated by processing pattern data 100, forming a resist pattern by developing the exposed resist, and forming a pattern by etching the copper foil of both the faces of the substrate forming the resist pattern. Then, the pattern manufacturing system comprises acquiring image information 200 by scanning a formation pattern after etching, comparing the line width of the pattern line of the image information 200 and the line width of the pattern line of a target formation pattern being a target after etching, adjusting the line width of the pattern line designated by the processing pattern data 100 on each front face and each rear face of the substrate on the basis of the comparison result, and directly drawing the resist by using the adjusted line width. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007033764(A) 申请公布日期 2007.02.08
申请号 JP20050215782 申请日期 2005.07.26
申请人 FUJIFILM HOLDINGS CORP;CMK CORP 发明人 SUGANUMA ATSUSHI;SHIMOYAMA YUJI;MIYANISHI MASATAKA;OKAYASU TAKASHI
分类号 G03F7/20;H05K3/00;H05K3/06 主分类号 G03F7/20
代理机构 代理人
主权项
地址