| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method and electronic component mounting equipment capable of planning an improvement of production efficiency by considering the number of intact component supply units of an identical kind with respect to a component supply unit for supplying electronic components with many mounting points, and by dispersing the electronic components to the intact component supply units to equalize a mounting time of each mounting head as much as possible. <P>SOLUTION: The shortest finish time Cs of a component at each component kind is calculated from a mounting point at each component kind and a mounting point under an optimum condition per mounting head and per unit time. There is determined whether such a component kind exists in which this shortest finish time Cs of the component is longer than the shortest finish time P of a printed circuit board. When it is determined that such a component kind exists, it is determined whether there exists an intact component supply unit 3 corresponding to the determined component kind. When it is determined that the intact component supply unit 3 exists, it is displayed on a monitor 36 that the component supply unit is dispersed and located in the intact component supply unit 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
