发明名称 WIRING CIRCUIT BOARD HAVING BUILT-IN PASSIVE ELEMENT, AND MANUFACTURING METHOD THEREFOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring circuit board having built-in passive elements, which circuit board contains a capacitance element having superior capacitance value precision and a resistance element adjusted exactly by trimming, and to provide a manufacturing method for the circuit board. <P>SOLUTION: According to the wiring board having the built-in passive elements, at least one wiring layer, vias, and passive elements are formed via an insulating layer 33. The passive elements consist of the capacitance element 40 and the resistance element 50. The capacitance element 40 is formed in such a way that a dielectric layer 21 is sandwiched between a capacitance element upper electrode 13a and a capacitance element lower electrode 12a. The resistance element 50 is formed on the insulating layer 33 on the dielectric layer 21. The capacitance element 40 is separated from the resistance element 50 across the insulating layer 33. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007036095(A) 申请公布日期 2007.02.08
申请号 JP20050220396 申请日期 2005.07.29
申请人 TOPPAN PRINTING CO LTD 发明人 SATO JIN;KAWAMOTO KENJI;SEKINE HIDEKATSU
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址