| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer holder for reducing the leakage of noise from an electrical heating element, and to provide a wafer prover apparatus for mounting the wafer holder. SOLUTION: The wafer holder 1 includes a chuck top 2 having a heating element 11 with a chuck top conductive layer 3 on the surface; and a support 4 for supporting the chuck top 2. The support 4 is covered with metal 50 at least partially, the distance between the metal 50 and the support 4 is≤preferably 5 mm, and especially the distance between the metal 50 and the support 4 is preferably≤1 mm and is more preferably≤0.2 mm. COPYRIGHT: (C)2007,JPO&INPIT |
