Semiconductor device for use in memory module has dummy substrate formed on semiconductor package and comprising of embedded discrete capacitor connected between first and second power signals

摘要

A dummy substrate (51) is formed on a semiconductor package (32) and comprising of an embedded discrete capacitor (55) connected between first and second power signals. The semiconductor package is configured to receive the first and second power signals. Independent claims are also included for the following: (1) a memory module; (2) a memory module printed circuit board; (3) and a memory system.