| 摘要 |
PROBLEM TO BE SOLVED: To provide a new semiconductor manufacturing device capable of measuring the shape of a semiconductor chip by obtaining sufficient illumination light. SOLUTION: The device comprises a wafer sheet 2 mounting the semiconductor chip 1, a suction nozzle 4 for performing suction from a surface where the semiconductor chip is not mounted on the wafer sheet, an illumination device 6 having a light source so as to radiate the light to the wafer sheet, an imaging apparatus 8 arranged at a semiconductor chip mounting side in order to image the transmission light of the illumination device 6, and an image processor for recognizing an image taken in from the imaging apparatus and measuring the position of the semiconductor chip. The suction nozzle 4 is provided with an illumination light guide plate 3 inside. The illumination device 6 is arranged in the support member 5 of the suction nozzle, emits the light by the radiation of the illumination light guide plate, and projects the semiconductor chip with respect to the imaging apparatus. COPYRIGHT: (C)2007,JPO&INPIT |
