Detachable bare chip module is formed in frame on printed circuit substrate and electrically connected to it by conductive spring matrix in construction frames

摘要

A detachable bare chip module (10) comprises a printed circuit on a substrate (20) and at least one non-encapsulated bare chip (30) with the substrate having positioning frames (21) for chip construction. The interior of each frame comprises a matrix of conductive springs in long and crossways directions each with an arrangement of inner electrical contacts to the printed circuit on the substrate and an elastic conductive contact at the other end so that the bare chip is in electrical contact with the springs through contacts on its base.