| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a simpler manufacturing method of a bonding pad, the bonding pad with good bondability, a manufacturing method of an electronic device, and the electronic device. <P>SOLUTION: The manufacturing method of the bonding pad 45 includes a step of placing a drop L comprising a liquid containing a conductive material on a substrate P by a drop discharging method, and a step of solidifying the drop L to form the pad. The formed bonding pad 45 is cylindrical and has a recessed dent 47. <P>COPYRIGHT: (C)2007,JPO&INPIT |
