| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a hygroscopicity of package from increasing by a method other than that of mixing additives in resin, and execute electrolytic plating required to ensure wire-bonding strength. <P>SOLUTION: Although a line-like electrode 16 (leading line) for electrolysis gilding is formed in a face 10B (rear face) of substrate 10 processed in no resin sealing, a leading line 16 is not formed in a chip-mounting face 10A. An electrode pattern 15 of the chip mounting face 10A and an electrode pattern 18 of rear face 10B are electrically connected via a through hole 17, and in the electrode patterns 15, 18 of each faces 10A, 10B and on the inner face of the through hole 17, coating by electrolytic gold plating is formed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
