| 摘要 |
PROBLEM TO BE SOLVED: To provide a die attach past for a semiconductor or a material for bonding a heat-dissipating member, which, in particular, has a low elastic modulus and excellent stress relaxation characteristics; and to provide a semiconductor device being excellent, in particular, in the reliability such as solder crack resistance. SOLUTION: The resin composition is used for bonding a semiconductor element or a heat-dissipating member to a substrate, and comprises (A) a compound having at least one functional group expressed by formula (1) (wherein R<SP>1</SP>is H or a methyl group), (B) a heat radical polymerization initiator and (C) a filler. COPYRIGHT: (C)2007,JPO&INPIT |
