| 摘要 |
PROBLEM TO BE SOLVED: To satisfy strength and conductivity required for a terminal part in addition to a fusing characteristic required for a fuse part. SOLUTION: In this plated copper alloy material, a Ni layer 2 is formed on a surface of a copper alloy base material 1, and a Ni/Sn-containing alloy layer 3 formed of a Ni-Sn alloy, a Ni-Cu-Sn alloy or both of them is formed on top of it, and a pure Sn layer 4 is formed on top of it as the outermost layer. The thickness of the Ni layer 2 is 0-10μm; in the Ni/Sn-containing alloy layer 3, the content of Ni is 0.02-75 at%, and the thickness thereof is 0.01-30μm; and the pure Sn layer 4 has a thickness of 0.1-30μm. The plated copper alloy material can be manufactured by forming a Ni-plated layer on the surface of the copper alloy base material, then forming a Sn-plated layer and thereafter executing a reflow treatment or a heating process or by forming the Ni-plated layer on the surface of the copper alloy base material and thereafter executing melted Sn plating on top of it. COPYRIGHT: (C)2007,JPO&INPIT
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