| 摘要 |
PROBLEM TO BE SOLVED: To provide reflow soldering equipment which is simple-structured and can solder each mount component on a substrate by properly and easily heating it, even if a plurality of mount components having different heat capacities are to be soldered to one and the same substrate, and also to provide a reflow soldering method. SOLUTION: A heating-up portion of a reflow furnace includes a nozzle 20 which blows off hot air H2 obliquely in the transferring direction X of the substrate 5 whereon the mount components 6A and 6B having different heat capacities are mounted on a cream solder 7. The hot air H2 blown off from the nozzle 20 is blown against the top and side faces of the mount component 6A having a larger heat capacity and against only the top face of the mount component 6B having a smaller heat capacity, reducing a temperature difference between the mount component 6A having a larger heat capacity and the mount component 6B having a smaller heat capacity. COPYRIGHT: (C)2007,JPO&INPIT |
