| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ultrasonic wire bonder which stabilizes impedance and a resonance frequency of a horn, and has stable bondability, and in which transmission of ultrasonic vibration amplitude is not inhibited while a structure at a periphery of a bonding tool comprising a conductor is reduced in a size, in a lateral direction for achieving usage in a narrow place with a barrier such as a casing of a semiconductor package in a wire bonding device which performs ultrasonic-bonding of the conductor and a material to be bonded. <P>SOLUTION: Conductor guides 11 and 12 are arranged in such a way that a supply route guiding the conductor 6 to vicinity of a tip of the bonding tool 7 is made almost parallel to the bonding tool 7, and is placed to a nearer position of a side opposite to a resonance object with respect to the bonding tool 7 as much as possible. <P>COPYRIGHT: (C)2007,JPO&INPIT |
