发明名称 ELECTRONIC COMPONENT MOUNTING EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To prevent other suction nozzle holding a good electronic component from dropping the electronic component in the way of movement for mounting the good electronic component when the suction state of the electronic component is poor. <P>SOLUTION: In the electronic component mounting equipment as shown on Fig. 6, the light receiving unit 46 of a line sensor unit 37 is located at a position shifted by 45&deg; from a suction position 101, for example. When a nozzle support 32 rotates intermittently in the arrow direction and a suction nozzle 15 sucking an electronic component passes through a detection position 102, attraction posture of the electronic component is detected by the line sensor unit 37. When abnormal posture is detected, a CPU 90 controls a linear motor 9 for moving a beam 8 in the Y direction and a linear motor 14 for moving a mounting head body 7 in the X direction along the beam 8 through a drive circuit 95 to decelerate in order to take out the electronic component by other subsequent suction nozzle 15, to recognize the component or to mount the electronic component on a printed board P. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007036163(A) 申请公布日期 2007.02.08
申请号 JP20050221638 申请日期 2005.07.29
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 KAMEDA MAKIO;URATA NAOKI;FUKUSHIMA YOSHIHARU;YAMAGUCHI MASAKI;IMOTO TAKUYA
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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