| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device extending operating time of a polishing pad. <P>SOLUTION: The polishing device is equipped with: the polishing pad 12 which has a circular shape polishing surface and rotates around the center of the polishing surface; and a polishing head which has a holding surface holding a wafer between the polishing head and the polishing pad 12, and rotates the wafer around its center, and the device polishes the wafer by the polishing surface. A groove 21 is formed on the polishing surface, and the groove 21 has a depth depending on a wear speed of the polishing surface. The groove is formed to be 2 mm depth at a central area 24 and a peripheral area 26, and 3 mm depth in an intermediate area 25. <P>COPYRIGHT: (C)2007,JPO&INPIT |
