| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device causing an excellent shielding effect to electrons and radiation noises from not only a top face but also all directions and a liquid crystal module. SOLUTION: A shielding member 12 is fitted as an electric-noise countermeasure for an IC chip 11 mounted on an FPC board 10. The shielding member 12 is continued to the FPC board 10, and a metallic-film coating surface region 122 given the grounding potential GND of the FPC board 10 on a base material 101 in the vicinity of the IC chip 11 is formed. The shielding member 12 is folded and shaped, and fixed by an adhesive member 13. A notch 123 conformed to the form of the IC chip 11 is formed so that the shielding member 12 is easily shaped. The metallic-film coating surface region 122 is coated with the adhesive member 13 through a resist member 103, a side section is coated from the upper section of the IC chip 11, and the region 122 is bonded on the FPC board 10 in the vicinity of a mounting surface. COPYRIGHT: (C)2007,JPO&INPIT |
