| 摘要 |
A wiring substrate 20 , comprising a glass substrate, formed by integrally bundling a plurality of glass fibers and provided with through holes 20 c, and conductive members 21 , disposed at through holes 20 c, is used. Input portions 21 a of conductive members 21 , formed on an input surface 20 a of this wiring substrate 20 , are connected to bump electrodes 17 , which are provided on an output surface 15 b of a PD array 15 in one-to-one correspondence with respect to conductive members 21 , thereby arranging a semiconductor device 5 . A radiation detector is arranged by connecting a scintillator 10 via an optical adhesive agent 11 to a light-incident surface 15 a of PD array 15 and connecting a signal processing element 30 via bump electrodes 31 to output surface 20 b of wiring substrate 20 . A semiconductor device, with which the semiconductor elements and the corresponding conductive paths of the wiring substrate are connected satisfactorily, and a radiation detector using this semiconductor device are thus provided.
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