HIGH DENSITY VERTICALLY STACKED SEMICONDUCTOR DEVICE

摘要

A high density, high speed semiconductor module (40) including a plurality of active semiconductor chip pairs (411, 412) bonded face-to-face. A functional system within the footprint of a single-chip package is provided by vertically stacking flip-chip pairs (411, 412) and interconnecting the chip pairs on a substrate (42) or package. Assembly of the device including various combinations of more than one chip pair, in combination with individual chips, advantageously utilizes known manufacturing technology and equipment.