| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of substrate sheet and a circuit board capable of reducing difference in quantity of solder adhered to external electrodes allocated in the two sides opposing with each other of a circuit board, and adhering the solder of sufficient quantity required for external electrodes. SOLUTION: A plurality of external electrodes 11c, 11m are provided in parallel along the two sides opposing with each other of a region 300 corresponding to the circuit board to be manufactured, and test electrodes connected to the external electrodes are formed via the extending conductors 13a, 13b extended to the external side of the region 300 from the external electrode. In this case, width of the extending conductors 13a, 13b is formed narrower than the width of the external electrodes 11c, 11m and test electrodes 12a, 12b. Therefore, a solder pool is formed to a wider part in the width changing area provided between the electrodes and conductors, and thereby the solder of the required quantity is adhered to the external electrodes 11c, 11m. COPYRIGHT: (C)2007,JPO&INPIT |
