| 摘要 |
PROBLEM TO BE SOLVED: To easily replace contacts for contact with IC terminals and eliminate the need for preparing IC sockets for every IC package in an IC testing apparatus for the electrical connection between ICs to be tested and IC terminals. SOLUTION: The IC testing apparatus is provided with: a wiring board 2 in which a plurality of through holes 6 are formed according to the arrangement of IC terminals 16 of an IC to be tested 14; the contacts 6 arranged in the through holes 6, electrically connected to wiring patterns 4, and each having one end to be in contact with an IC terminal 14; and a second substrate 20 mounted to the surface of the wiring substrate 2 on the side opposite to the surface facing the IC to be tested 14 in such a way as to be attached and removed for supporting the other end of a contact 6. COPYRIGHT: (C)2007,JPO&INPIT
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