| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems, wherein a package formed of ceramic is relatively expensive, since a ceramic has a high degree of hardness, when a stress is applied to the package from outside, the package will not deform, and chips or cracks tend to be generated in the package itself; since ceramics are usually formed by sintering, when the ceramic is formed as a package, variation in the outside dimensions or the like are large. SOLUTION: The piezoelectric device is a mold package in which the package molds a lead frame with resin, wherein a ring-shaped jointing material is formed on a sidewall tip face of the package surrounding an opening of the package, a metal lid body is arranged on the jointing material, in a form of stopping the package opening, and an inner space of the package is sealed to be airtight by jointing the lid body and the jointing material. COPYRIGHT: (C)2007,JPO&INPIT
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