| 发明名称 |
ANTISTICTION MEMS SUBSTRATE AND METHOD OF MANUFACTURE |
| 摘要 |
A composite wafer for fabricating MEMS devices is provided with a plurality of antistiction bumps, buried under a device layer of the composite wafer. The antistiction bumps are prepared lithographically, by patterning an antistiction material prior to the assembly of the composite wafer.
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| 申请公布号 |
WO2006138126(A3) |
申请公布日期 |
2007.02.08 |
| 申请号 |
WO2006US22076 |
申请日期 |
2006.06.07 |
| 申请人 |
INNOVATIVE MICRO TECHNOLOGY;RUBEL, PAUL, J. |
发明人 |
RUBEL, PAUL, J. |
| 分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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