| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device which allows stable measurement of the connection strength of a metal bump. <P>SOLUTION: A load cell unit having an ultrasonic applying unit connects a metal wire 3 by ultrasonic waves to a metal bump 2 on a pad 1b of a semiconductor wafer 1. The metal wire 3 is pulled up in the vertical direction by the load cell unit to test the connection strength of the metal bump 2. This allows stable measurements of the vertical connection strength of the metal bump 2, the connection strength of which is actually required, when a semiconductor chip is mounted. The stable measurement allows precise understanding of the vertical connection strength of the metal bump 2. <P>COPYRIGHT: (C)2007,JPO&INPIT |
