摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition from which a pattern or a coating film excellent in solvent resistance can be formed. <P>SOLUTION: The photosensitive resin composition contains a binder resin (A), a photopolymerizable compound (B), a photopolymerization initiator (C) and a solvent (D), wherein the binder resin (A) comprises a polymer (AA) containing a structural unit (A1) derived from at least one kind of compound selected from a group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides, a structural unit (A2) derived from an unsaturated compound having at least one kind of group selected from a group consisting of active methylene groups and active methine groups, and a structural unit (A3) derived from a monomer copolymerizable with the structural unit (A1) and the structural unit (A2), however, (A3) excluding the structural unit (A1) and the structural unit (A2). <P>COPYRIGHT: (C)2007,JPO&INPIT |