发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition from which a pattern or a coating film excellent in solvent resistance can be formed. <P>SOLUTION: The photosensitive resin composition contains a binder resin (A), a photopolymerizable compound (B), a photopolymerization initiator (C) and a solvent (D), wherein the binder resin (A) comprises a polymer (AA) containing a structural unit (A1) derived from at least one kind of compound selected from a group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides, a structural unit (A2) derived from an unsaturated compound having at least one kind of group selected from a group consisting of active methylene groups and active methine groups, and a structural unit (A3) derived from a monomer copolymerizable with the structural unit (A1) and the structural unit (A2), however, (A3) excluding the structural unit (A1) and the structural unit (A2). <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007034134(A) 申请公布日期 2007.02.08
申请号 JP20050220344 申请日期 2005.07.29
申请人 SUMITOMO CHEMICAL CO LTD 发明人 TAKEBE KAZUO;MORIKAWA MICHITAKA
分类号 G03F7/033;G02B5/20 主分类号 G03F7/033
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