发明名称 PLASMA TREATMENT DEVICE AND TREATMENT METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment device having high uniformity of plasma and enhanced stability of plasma. <P>SOLUTION: The plasma treatment device, provided with a treatment chamber 0111 whose inside is to be evacuated, a substrate electrode 0113 fitted inside the treatment chamber with a treated substrate 0112 arranged, an electromagnetic wave generating device 0101 for generating plasma inside the treatment chamber , a supply system (not illustrated) for supplying treatment gas inside the treatment chamber, and a vacuum exhaustion system (not illustrated) for evacuating the inside of the treatment chamber, is further provided with a polarization plane control mechanism 0106 for making the electromagnetic wave generating device 0101 generate electromagnetic waves of controlled frequencies and controlling the planes of polarization in accordance with the frequencies of the elctromagnetic waves. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007035597(A) 申请公布日期 2007.02.08
申请号 JP20050221505 申请日期 2005.07.29
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 TAMURA HITOSHI
分类号 H05H1/46;C23F4/00 主分类号 H05H1/46
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