| 摘要 |
PROBLEM TO BE SOLVED: To provide both a resin composition capable of affording a cured product having all good characteristics such as a high permittivity, a low dielectric dissipation factor, mechanical strength, shock and thermal shock resistances and a material for electronic parts utilizing the composition. SOLUTION: This resin composition comprises a siloxane-containing polyamideimide resin represented by formula (I) [wherein, R1 is one kind selected from formulae (II); R2 is one kind selected from formula (III); R3 is represented by formula (IV); R4 and R5 are each a bivalent organic group; R6 to R9 are each independently one kind selected from an alkyl group, phenyl group or a substituted phenyl group; n is an integer of 0-90; m is an integer of 5-350;, p is an integer of 1-50; and the ratio of n to m is (7:3) to (0:10)], a high-permittivity filler and an epoxy resin. The cured product thereof has >=15 specific permittivity at 25 deg.C and 1 MHz. A wiring board material and a wiring board comprise an insulating layer composed of the resin composition. |
