| 摘要 |
<p>In an electronic parts packaging structure of the present invention, an electronic parts (40) is mounted or formed on a silicon circuit substrate (1) having a structure in which wiring layers (32, 26) on both sides thereof are connected to each other through a through electrode (16), and a protruded bonding portion (50b) which is ring-shaped and is made of glass, of a seal cap (50x) having a structure in which a cavity (50a) is constituted by the protruded bonding portion (50b), is anodically bonded to a bonding portion (10b) of the silicon circuit substrate (1), thus, the electronic parts (40) is hermetically sealed in the cavity (50a) of the sealing cap (50x).</p> |
