| 摘要 |
<p>Provided is a radio frequency (RF) receiver chip improved with an electrostatic discharge (ESD) level. The RF receiver chip comprises an input terminal, a ground voltage terminal, and at least one bond-wire inductor. The bond-wire inductor couples the input terminal with the ground voltage terminal to reduce an electrostatic discharge (ESD) level and configure an input impedance matching circuit. Using the bond-wire inductor can improve the ESD level and minimize an increase of a noise figure. Also, the length of the bond-wire inductor can be adjusted through various coupling configurations to make ease of input matching.</p> |
