| 摘要 |
An apparatus (200) and method is provided which permits effective removal of a circuit board from sealed housing while minimizing stress, bending and flexing of circuit board sufficiently to prevent damage to circuit board and its electronic components. The apparatus includes a base (204) to support the housing (16) and a force transmitter 104 to transmit a separation force to the exposed surfaces (30, 34, 36) of one or more connectors of the circuit board. This apparatus effectively distributes the separation force across exposed surfaces of the connectors to create substantially uniform pressure on the connectors and thus the circuit board. The apparatus (200) separates the circuit board (32) from the housing (16) by applying a pulling force (202) to the connector (34) of the circuit board (32). |
