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经营范围
发明名称
Epoxy resin for packaging semiconductor device
摘要
申请公布号
KR20070016049(A)
申请公布日期
2007.02.07
申请号
KR20050091006
申请日期
2005.09.29
申请人
发明人
分类号
C08G59/40
主分类号
C08G59/40
代理机构
代理人
主权项
地址
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