Low cross-talk ball grid array resistor network

摘要

Several resistors (14) are provided on the top surface (12) of substrate (11). A common via (22) is provided through the substrate and is connected to one end of the resistors, whose other end is connected to several input vias (18). Several solder spheres (28) are provided on the bottom surface of the substrate and connects the common via with the input vias. A star-shaped common conductor (20) is comprised between the common via and the resistors.