| 摘要 |
A light emitting diode (LED) comprises a bracing frame 10, at least two chips 30, 40, 50 stacked on the bracing frame 10 in a chip-on-chip stacking manner, and a transparent layer 20 encapsulating the chips 30, 40, 50. The chips 30, 40 , 50 are electrically connected using wire bonding or flip-chip bonding methods. The bracing frame 10 comprises a metal frame, printed circuit board or a substrate made of aluminium or a ceramic material. Each chip 30, 40, 50 emits light of a different wavelength. Therefore, the vertical stacking arrangement allows for maximum optical overlap of the chips 30, 40, 50 leading to uniform colour mixing. The LED may further comprise a control circuit (80 figs 9 and 10) connected to the chips 30, 40, 50. The control circuit (80) may be external to the LED or it may be built-in. |
