| 摘要 |
PURPOSE: A semiconductor package is provided to discharge moisture to the outside by filling porous material into a plurality of via-holes formed within a chip loading region of a printed circuit board. CONSTITUTION: A printed circuit board is formed with a resin layer(16), a conductive pattern(18), and a cover coat(20). The resin layer(16) is used as a base layer. The conductive pattern(18) is formed on both sides of the resin layer(16). The cover coat(20) is used for protecting the conductive pattern(18). A chip loading region of the printed circuit board is filled by a plurality of vent holes(30) and a porous material(14). A semiconductor chip(22) is adhered to the chip loading region of the printed circuit board by an adhesive member(28). A wire(24) is bonded between a bonding pad of the semiconductor chip(22) and the conductive pattern(18) of the printed circuit board. A resin(26) is molded on the semiconductor chip(22), the wire(24), and the printed circuit board. A solder ball(32) is fused on the conductive pattern(18). |
