发明名称 |
System and method for manufacturing flexible copper clad laminate film |
摘要 |
<p>Disclosed is a system and a method for manufacturing flexible copper clad laminate film capable of efficiently electroplating both surfaces of a polyimide-based film to form copper plating layers thereon while making it easy to repair and maintain the apparatus or clean its plating or cleaning bath. The system includes a pickling device adapted to spray a pickling liquid to both surfaces of a to-be-plated film to remove oxide coatings from the copper coatings; a number of water-cleaning devices for removing the pickling liquid and copper electrolyte remaining on the film; at least one plating device positioned between the water-cleaning devices to form copper plating layers on both surfaces of the film; an antirust device for preventing the copper plating layers, which have been formed by the plating device, from rusting; and a drying device for drying the antirust liquid on the film, which has been subjected to antirust treatment.</p> |
申请公布号 |
EP1750491(A2) |
申请公布日期 |
2007.02.07 |
申请号 |
EP20050024159 |
申请日期 |
2005.11.05 |
申请人 |
KOREAN INSTITUTE OF INDUSTRIAL TECHNOLOGY |
发明人 |
LEE, HONG KEE;SON, SEONG-HO;KOO, SEOK BON |
分类号 |
H05K3/24;C25D5/34;C25D7/06;H05K1/00;H05K3/28 |
主分类号 |
H05K3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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