发明名称 Process for the wet chemical treatment of semiconductor wafers
摘要 A process for the wet chemical treatment of semiconductor wafers, in which the semiconductor wafers are treated with treatment liquids, has the semiconductor wafers firstly treated with an aqueous HF solution, then treated with an aqueous O<SUB>3 </SUB>solution and finally treated with water or an aqueous HCl solution, these treatments forming a treatment sequence.
申请公布号 US7172975(B2) 申请公布日期 2007.02.06
申请号 US19990425694 申请日期 1999.10.22
申请人 SILTRONIC AG 发明人 BRUNNER ROLAND;SCHWENK HELMUT;ZACH JOHANN
分类号 H01L21/02;H01L21/304;H01L21/306;H01L21/308 主分类号 H01L21/02
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