发明名称 Semiconductor device and method of manufacturing the same
摘要 Plural trench isolation films ( 4 ) are provided with portions of an SOI layer ( 3 ) interposed therebetween in a surface of the SOI layer ( 3 ) in a resistor region (RR) where a spiral inductor (SI) is to be provided. Resistive element ( 30 ) are formed on the trench isolation films ( 4 ), respectively. Each of the trench isolation films ( 4 ) includes a central portion which passes through the SOI layer ( 3 ) and reaches a buried oxide film ( 2 ) to include a full-trench isolation structure, and opposite side portions each of which passes through only a portion of the SOI layer ( 3 ) and is located on the SOI layer 3 to include a partial-trench isolation structure. Thus, each of the trench isolation films ( 4 ) includes a hybrid-trench isolation structure.
申请公布号 US7173319(B2) 申请公布日期 2007.02.06
申请号 US20040002142 申请日期 2004.12.03
申请人 发明人
分类号 H01L21/76;H01L29/80;H01L21/762;H01L21/822;H01L21/8234;H01L21/84;H01L27/04;H01L27/06;H01L27/08;H01L27/082;H01L27/12;H01L27/13;H01L29/786;H01L31/112 主分类号 H01L21/76
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