发明名称 High-frequency wiring structure and method for producing the same
摘要 A high-frequency wiring structure includes a microstrip line having a ground conductor, a dielectric disposed on the ground conductor, and a transmission conductor that is at least partially disposed in the dielectric. The transmission conductor is defined by a flat bottom parallel to the ground conductor, a pair of flat sides that are perpendicular to the ground conductor and are positioned on both sides of the flat bottom in the wiring width direction, and curved parts that continuously join the flat bottom and the pair of flat sides. The curved parts have a radius of curvature within the range of 5% to 50% of the thickness of the transmission conductor.
申请公布号 US7172958(B2) 申请公布日期 2007.02.06
申请号 US20050050112 申请日期 2005.02.02
申请人 ALPS ELECTRIC CO., LTD. 发明人 SASAKI YORIHIKO
分类号 H01L21/44;H01L21/469;H01L21/48;H01L21/50;H01L21/68;H01L23/053;H01L23/12;H01L23/52;H01P3/08;H01P11/00;H05K1/02;H05K3/02;H05K3/04;H05K3/10;H05K3/18;H05K3/20;H05K3/22 主分类号 H01L21/44
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