| 摘要 |
A method of fabricating an integrated spatial light modulator. The method includes providing a first substrate including a bonding surface, processing a device substrate to form at least an electrode layer, the electrode layer including a plurality of electrodes, and depositing a standoff layer on the electrode layer. The method further includes forming standoff structures from the standoff layer and joining the bonding surface of the first substrate to the standoff structures on the device substrate. In a particular embodiment, the method further includes, after the step of depositing a standoff layer, performing chemical mechanical polishing of the standoff layer to planarize an upper surface of the standoff layer.
|
