High performance thermally enhanced package and method of fabricating the same

摘要

A high performance thermally enhanced package and method of fabricating the same is provided. A chip (a wire bond chip or a flip chip) and a carrier (lead frame or tape carrier) are bonded together using flip-chip technology and thermal compression. The chip and the carrier are encapsulated using a molding compound. The package has a smaller overall size and the capacity to withstand electromagnetic interference.