| 摘要 |
PROBLEM TO BE SOLVED: To provide a waveguide device manufacturing method that suppresses separation and generation of air bubbles between a lower clad layer and a waveguide layer of the waveguide device and that facilitates the manufacturing through a reduced number of processes. SOLUTION: The manufacturing method of a waveguide device includes: the first process in which a solution of a waveguide layer material is applied on a first substrate and hardened to form a waveguide layer; the second process in which an adhesive is imparted onto the waveguide layer so formed and in which the second substrate is placed on the adhesive to stick the waveguide layer and the second substrate together by hardening the adhesive; and the third process in which the waveguide layer is peeled from the first substrate and transferred to the second substrate. The adhesive application method in the second process is characterized in that, in the center of either the first or the second substrate, the adhesive is dripped in the amount equal to or in excess of the volume computed from the area of the waveguide element part and from the thickness of the adhesive layer to be formed, and that the adhesive is pressed with the other substrate so as to be spread, with the adhesive layer formed to stick the substrate together. COPYRIGHT: (C)2007,JPO&INPIT |
