| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate drying apparatus capable of making the degree of dryness between wafers uniform, compared with conventional semiconductor drying apparatuses. SOLUTION: A semiconductor substrate drying apparatus comprises: a drying chamber 100 providing a space performing a drying step; a supporting member arranged in the drying chamber 100 to arrange a substrate; and a dry gas supply member 400 supplying dry gas onto the substrate. The dry gas supply member 400 is provided with a plurality of injection holes for injecting dry gas; a plurality of nozzles 420 and 440 including at least one of a plurality of injection holes; and dry gas supply piping 460 having a flow regulator 480 installed and supplying a plurality of dry gases. One nozzle 420 and other nozzles 440 are connected to the dry gas supply piping 460 that are different from each other. COPYRIGHT: (C)2007,JPO&INPIT
|
