| 摘要 |
A semiconductor wafer is provided with a wiring structure, and semiconductor chip positions arranged in rows and columns. The semiconductor wafer has at least one coating ( 6 ) as a self-supporting dimensionally stable substrate layer ( 4 ), and/or as a wiring structure composed of conductive, high-temperature-resistant material. The coating material ( 6 ) of the substrate layer ( 4 ) and/or of the wiring structure has a ternary carbide and/or a ternary nitride and/or carbon.
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