发明名称 |
Resin composition for thermally conductive material and thermally conductive material |
摘要 |
The present invention is characterized by a resin composition for a thermal conductive material including a polymer (I), a liquid-state plasticizer (II) and a thermal conductive filler (III) having a thermal conductivity of 20 W/m.K or more, wherein the liquid-state plasticizer (II) is in a liquid state at 25° C., and has a mass loss rate of 2 mass % or less when kept at 130° C. for 24 hours. By using this resin composition for a thermal conductive material, it becomes possible to obtain a thermal conductive material having superior thermal conductivity and flexibility.
|
申请公布号 |
US2007027254(A1) |
申请公布日期 |
2007.02.01 |
申请号 |
US20050557786 |
申请日期 |
2005.11.18 |
申请人 |
KAWATA YUICHI;TANAKA NAOKO |
发明人 |
KAWATA YUICHI;TANAKA NAOKO |
分类号 |
C08F8/00;C08K3/00;H01L23/373 |
主分类号 |
C08F8/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|