| 摘要 |
A plurality of wiring layers made from a conductive material are formed in the same level layer on a substrate. A plurality of cavity layers are formed in the same level layer as the plurality of wiring layers. The plurality of cavity layers have a cavity ratio which is not smaller than 60%. An interlayer insulating film is formed on the plurality of wiring layers and on the plurality of cavity layers. A barrier metal, an oxygen barrier layer and an insulating layer are formed on side walls of the plurality of wiring layers.
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