发明名称 Feed through structure for optical semiconductor package
摘要 Includes a stem with a hole, a dielectric sealed into the hole of the stem and including a pair of pin insertion holes, and a pair of high frequency signal pins that penetrate and fit into the pair of pin insertion holes of the dielectric, and constituting differential lines connected to an optical semiconductor element.
申请公布号 US2007023766(A1) 申请公布日期 2007.02.01
申请号 US20060542230 申请日期 2006.10.04
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 ARUGA HIROSHI;TAKAGI SHINICHI;SAKAI KIYOHIDE
分类号 G02B6/42;H01S5/022 主分类号 G02B6/42
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