SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE FABRICATION METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD PROGRAM AND SEMICONDUCTOR FABRICATION DEVICE

摘要

There are provided a semiconductor device having a micro structure capable of compensating irregularities in the fabrication stage by using a result of a test performed by a tester, its fabrication method, its fabrication method program, and a semiconductor fabrication device. In a tester (1), a test sound wave is inputted so as to detect an output voltage of the device responding to the input of the test sound wave. A bonder (60) receives a test result from the tester (1) and performs classification of the device. Bonding is performed for adjusting the amplification ratio of an amplifier corresponding to the classified group.