发明名称 |
Substrate and process for producing the same |
摘要 |
A photosensitive transparent resin film, provided selectively with a groove reaching a transparent substrate is formed on the transparent substrate, and a wiring portion is provided in the groove substantially in flush with the photosensitive transparent resin film. The wiring portion can be formed quickly while controlling the thickness easily by preprocessing the surface of the photosensitive transparent resin film or the bottom face of the groove before the wiring portion is set in the groove.
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申请公布号 |
US2007024800(A1) |
申请公布日期 |
2007.02.01 |
申请号 |
US20050558934 |
申请日期 |
2005.12.02 |
申请人 |
OHMI TADAHIRO;MORIMOTO AKIHIRO;SUZUKI TERUHIKO;KATO TAKEYOSHI |
发明人 |
OHMI TADAHIRO;MORIMOTO AKIHIRO;SUZUKI TERUHIKO;KATO TAKEYOSHI |
分类号 |
G02F1/1333;H05K3/00;H05K3/10;H05K3/14 |
主分类号 |
G02F1/1333 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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