发明名称 IMPROVED MAGNETRON SPUTTERING SYSTEM FOR LARGE-AREA SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide an apparatus for processing a surface of a substrate in physical vapor deposition (PVD) chamber that has an increased anode surface area to improve the deposition uniformity on large area substrates, and to provide a method therefor. <P>SOLUTION: In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, the processing chamber contains one or more adjustable anode assemblies that are used to increase and more evenly distribute the anode surface area throughout the processing region of the processing chamber. In one aspect, the one or more adjustable anode assemblies are adapted to exchange deposited on anode surfaces with new, un-deposited on, anode surfaces without breaking vacuum. In another aspect, a shadow frame that has a path to ground is adapted to contact a deposited layer on the surface of a substrate during deposition to increase the anode area and thus deposition uniformity. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007023376(A) 申请公布日期 2007.02.01
申请号 JP20050326956 申请日期 2005.11.11
申请人 APPLIED MATERIALS INC 发明人 WHITE JOHN;HOSOKAWA AKIHIRO;LE HIEN-MINH HUU;INAGAWA MAKOTO
分类号 C23C14/34;H05H1/24 主分类号 C23C14/34
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