| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and an electronic device, which are reduced in size and improved in electric reliability between the semiconductor device and a mounting board. <P>SOLUTION: On a board 13 on the side where a plurality of semiconductor chips 11-1, 11-2, 12-1, 12-2 are connected, an external connection terminal 27 is provided to electrically connect with the semiconductor chips 11-1, 11-2, 12-1, 12-2, and to project from the semiconductor chips 11-1, 11-2, 12-1, 12-2. <P>COPYRIGHT: (C)2007,JPO&INPIT |
